3D MICROMAC PDF

The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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We d3 our customers across the entire product life cycle, from process development and selection of a suitable machine design to commissioning and comprehensive servicing. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules.

As a result, chip manufacturers are turning toward vertical stacking of devices and heterogenous integration schemes to enable smaller, higher-performance devices. All methods comply with the requirements mifromac industrial display production and guarantee clean and gentle processing, without any discoloration of the material, and excellent edge quality and breakage resistance. With that we have established a strong foundation for dynamic growth in international markets. The four major European semiconductor and system suppliers Infineon, STMicroelectronics, Bosch and Thales will collaborate with eleven equipment and analytical method suppliers from Germany and France.

Since we place great importance on continually expanding our know-how, we are diligent about keeping up with the latest research. The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates.

They are characterized by extraordinary reliability and productivity, fine precision, and flexibility.

The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio. Our technologies have set international standards for true innovation. For the past 16 years, the name 3D-Micromac AG stands for highest quality and satisfied customers.

Company – Laser Micromachining – 3D-Micromac AG

As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for 3e comprehensive testing of complex structures. At 3D-Micromac, we not only successfully provide our customers with high quality, reliable and user-friendly standard systems for all applications in laser micromachining, we also provide branch-specific solutions.

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This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to design innovative MtM and SiP products in respect to reliability, quality, micronac and shorter time to market to ensure leadership in a global perspective.

More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e. A main aspect in technological developments for photovoltaics is the reduction of cost per power of the solar panel. The microPREP systems an be used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics.

As a result of the project, demonstrators are being developed that illustrate the power of the technology. Whether Standard System or Special Solution: From the founding of our company until mocromac we have constantly been able to achieve important milestones:. The main goal is to separate the cells without inducing damage at the cutting edge. Production Solutions for Innovators and Growth Markets.

We use cookies to ensure that we give you the best experience on our website. This opens up a huge variety of possibilities and niche applications for BIPV.

The DMP solutions for Micro Laser Sintering deliver best results in terms of detail resolution, accuracy and surface finish for 3D printed micro metal parts.

The focus here is on thin glass, which offers advantages over plastic as a substrate due to its outstanding barrier properties. This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device. Although lasers are well established tools in manifold applications, they have been broadly ignored for use in sample preparation due to concerns regarding their potential for causing structural damage.

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Our products help increase production efficiency, optimize processes and lower costs in various areas of technology. With the provision of the technology for crack-free separation of thin glass laminates, the 3D-Micromac AG is an important partner in the project. Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene — speeding up microstructure diagnostics and failure analysis as well as opening up access to microac buried micgomac and large-area preparation.

Strategic realignment focusing on industrial growth markets In addition, 3D-Micromac has a fully equipped application laboratory with experienced process engineers to support customers in feasibility tests, process development, and realization of customized solutions.

microDICE – Laser Micromachining – 3D-Micromac AG

It is only because of our laser processes that efficient series production of new and innovative components and products are micromsc possible. The work is supported by five academic institute partners. In addition work will directed to efficient protective coatings for the OLEDs as well as to transparent electrical contacts which give added value to the lighting market.

Our target is to completely satisfy customer demands even on the most complex projects.

3D-Micromac – Micromachining Excellence

Opening of the company headquarters at the Chemnitz Technology Campus Brittle-rigid materials such as glass, ceramic and sapphire have excellent material properties that make them indispensible for use in the production of electronics. Those properties should be unchanged after cutting. As a further challenge, laser cutting and micromsc processes are developed for substrate separation and interconnection.

Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer miromac highest possible process reliability and a maximum speed of machining.